TRinno Technology Co., Ltd.
A leader in power semiconductor technology
Unit Process Service
TRinno Technology has its proprietary ‘ultra-thin wafer processing technology’ known as the state of the art process among the power semiconductor process technologies and has the s facilities and factories capable of processing 60-100μm wafer thinning process based on 6-inch wafer in Gongreung-dong, Seoul.
Our factory is capable of various processes including the ion implantation, metallization and wafer level test, as well as backside grinding for wafer thinning process, and can apply the technologies for power semiconductor implementation. TRinno Technology provides the following process services that can meet the requirements of customers.
Unit Process
